台式机主板标准

1英特尔公司对此ATX不作任何保证 规范（“规范”），尤其不保证或代表 本规范或任何符合本规范的产品都能正常工作 以预定的方式。英特尔也不承担任何错误的责任 规范可能包含或有任何责任或义务 惩罚性赔偿，包括但不限于间接损害赔偿 间接损害，无论是由于使用 以任何方式。

ATX是作为Baby-AT外形的演变而开发的，旨在解决四个主要问题改进领域：增强易用性，更好地支持当前和将来的I / O，更好地支持当前和将来的处理器技术，并降低了系统总成本。 ATX结合了主导计算机行业的外形尺寸中的最佳功能。 1990年代初期：LPX的高度集成和Baby-AT的可扩展性。 ATX尺寸为实际上，Baby AT主板在机箱外壳内旋转了90度，并提供了一个新的电源的安装配置。 处理器已从扩展槽移开，允许他们全都持有全长附加卡。 板子较长的一面用于承载更多板载I / O。 如果不减少系统总成本，更改系统外形尺寸最终将无济于事。ATX通过多种方式降低了成本： •电缆和附加卡的材料成本降低了，因为可以将更多的I / O集成到板，因为可以更好地放置硬盘驱动器和软盘连接器，从而可以使用较短的电缆。 •集成I / O中断的另一个好处是，通过消除I / O，可以降低EMI辐射。可以像天线一样工作的串行和并行电缆。 •减少了制造时间和库存持有成本，因为系统减少了。 •视频播放增强的图形和音频，支持的主要硬件构建块多媒体正在成为许多PC的标准；在入门级，这些功能很快成为商品。为了降低对美元高度敏感的细分市场的成本，将这些功能迁移到主板本身。 ATX规范是作为行业开放规范编写的，旨在为PC增值建筑。

ATX was developed as an evolution of the Baby-AT form factor and was defined to address four major areas of improvement: enhanced ease-of-use, better support for current and future I/O, better support for current and future processor technology, and reduced total system cost. ATX combines the best functionality from the form factors that dominated the computer industry in the early 1990s: the high integration of LPX and the expandability of Baby-AT. The ATX form factor is essentially a Baby AT motherboard rotated 90 degrees within the chassis enclosure and providing a new mounting configuration for the power supply. The processor is relocated away from the expansion slots, allowing them all to hold full length add-in cards. The longer side of the board is used to host more onboard I/O. Table 1 summarizes the ATX features. A change to the system form factor is ultimately of little benefit if it does not reduce overall system cost. ATX has achieved cost reduction in a number of ways: • Material cost of cables and add-in cards is reduced because more I/O can be integrated down onto the board and because the hard drive and floppy connectors can be better positioned, allowing the use of shorter cables. • Another benefit of integrated I/O down is the potential for lower EMI emissions with the removal of serial and parallel cables that can act like antennas. • Manufacturing time and inventory holding costs are reduced because the number of cables in the system is reduced. • Video-playback enhanced graphics and audio, the main hardware building blocks to support multimedia, are becoming a standard on many PCs; at the entry level, these features are quickly becoming a commodity. To reduce cost in a highly dollar-sensitive market segment, it makes sense to migrate these features down to the motherboard itself. The ATX specification is written as an open specification for the industry, designed to add value to PC architecture.

Contents 1. Executive Summary......................................................................................................7 2. ATX Form-factor Overview...........................................................................................8 3. Layout ............................................................................................................................9 3.1 Board Size......................................................................................................................................... 9 3.2 Mounting Hole Placement .................................................................................................................. 9 3.3 Connector Placement ........................................................................................................................ 11 3.3.1 Expansion slots ..................................................................................................................... 11 3.3.2 Power Input ........................................................................................................................... 13 3.3.3 Disk I/O ................................................................................................................................ 13 3.3.4 Front Panel I/O...................................................................................................................... 13 3.3.5 Back Panel I/O ...................................................................................................................... 13 3.3.6 Memory Sockets ................................................................................................................... 16 3.3.7 Processor .............................................................................................................................. 16 3.4 Height Constraints............................................................................................................................. 16 3.4.1 Primary (Component) Side Height Constraints..................................................................... 16 3.4.2 Secondary (Bottom/Solder) Side Height Constraints ............................................................ 18 4. Power Delivery ..............................................................................................................19 4.1 Power Supply Connectors.................................................................................................................. 19 4.1.1 Aux Power Connector for 250 W and 300 W Configurations ............................................... 20 4.1.2 2x2 Connector...................................................................................................................... 20 4.1.3 Power Signal Control Definitions........................................................................................... 20 4.1.4 Voltage Tolerances ............................................................................................................... 21 4.2 Optional Power Connector ................................................................................................................. 21 4.2.1 FanM Signal .......................................................................................................................... 22 4.2.2 FanC Signal .......................................................................................................................... 22 4.2.3 3.3 V Sense Line................................................................................................................... 23 4.2.4 1394 V Pin............................................................................................................................ 23 4.2.5 1394R Pin ............................................................................................................................. 23 5. Other ATX Chassis Considerations.............................................................................24 5.1 Venting .............................................................................................................................................. 24 5.2 Power Supply Mounting ..................................................................................................................... 24 6. Additional Information ..................................................................................................24

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ATX主板详细介绍，其中含有主板尺寸及螺丝孔位置等内容，有助于DIYers自己设计机箱。